Avène Cicalfate+ Restorative Protective Cream

Benefits of Avène Cicalfate+ Restorative Protective Cream

• Restores skin barrier 4× faster and provides immediate soothing after the first use
• Purifies with copper- and zinc-sulfate complex to prevent microbial irritation
• Forms a protective, non-sticky film that supports healing and guards delicate areas
• Suitable for infants, adults, and intimate areas—ideal for eczema, diaper rash, cuts, and sun-exposed skin

How To Use Avène Cicalfate+ Restorative Protective Cream

Apply to clean, dry skin on face or body as needed. Gently massage to create a protective layer. Reapply frequently, especially after washing or when skin is exposed to irritants.

Avène Cicalfate+ Restorative Protective Cream Ingredients

KEY INGREDIENTS

Avène Thermal Spring Water: Calms, softens, and soothes skin with rich trace minerals

C+‑Restore™ Post-Biotic Complex: Patented biotechnology derived from thermal spring water, shown to accelerate barrier restoration 4× in 48 hours

Copper Sulfate & Zinc Sulfate: Purifying mineral complex that limits microbial growth and supports skin health

Beeswax & Caprylic/Capric Triglyceride: Emollients that provide nourishing hydration and a protective “dressing” texture

INGREDIENTS

Avène Thermal Spring Water, Caprylic/Capric Triglyceride, Mineral Oil (Paraffinum Liquidum), Glycerin, Hydrogenated Vegetable Oil, Zinc Oxide, Propylene Glycol, Polyglyceryl-2 Sesquiisostearate, PEG‑22/Dodecyl Glycol Copolymer, Aluminum Sucrose Octasulfate (Sucralfate), Aluminum Stearate, Aquaphilus Dolomiae Ferment Filtrate, Arginine, Beeswax (Cera Alba), Copper Sulfate, Magnesium Stearate, Magnesium Sulfate, Microcrystalline Wax, Tromethamine, Zinc Sulfate

Skin Elite is dedicated to maintaining the accuracy of the ingredient lists on this website. However, because ingredients are subject to change, we cannot guarantee that these lists are complete, up‑to‑date and/or error‑free. For an accurate listing of ingredients in each product, please refer to your product packaging.